AR
C
HIVE INF
O
RMATI
O
N
A
RCHIVE INFORMATION
MRF372R3 MRF372R5
9
RF Device Data
Freescale Semiconductor
MRF372
Rev. 1a
L1A
C4 C6C5
C10
C11
C12
R6A
C8A
R9A
R4TA
R3A
L2A
C15AR10A
L3A
C16A
L1B
C14B
L2B
R10BC15B
C16B
C14A
R6B
C14D
C13
L3C
R9C
R9D
C17B
R3B
R2B
C1
C3A
C3B
C7A
C7B
R7
R4TB
R1B
R5A
R5B
R1A
C14C
C2
C9A
C9B
R8
C18A
C18B
C17A
R9B
C8B
R2A
L3B
Figure 11. 470--860 MHz Broadband Component Layout
PCB Substrate (30 mil thick)
Motorola Vertical 660 MHz Balun
Rogers RO3010 (50 mil thick)
55 mil slot cut
out to accept Balun
Input
(50 ohm microstrip)
Output 2
(12.5 ohm microstrip)
Ground
Vertical Balun Mounting Detail
Note:
TrimBalunPCBsothata35mil“tab”
fits into the main PCB “slot” resulting
in Balun solder pads being level with
the PCB substrate solder pads when
fully inserted.
Output 1
(12.5 ohm microstrip)
Freescale has begun the transition of marking Printed Circuit Boards (PCBs) with the Freescale
Semiconductor signature/logo. PCBs may have either Motorola or Freescale markings during the
transition period. These changes will have no impact on form, fit or function of the current product.
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